通信/电子/硬件工程领域需求澄清术语包（草案）
草稿，非正式模板
本包在上游标记为 draft，未作为可执行提示词收录，不代表专业意见或已核验建议。
原文
json
{
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"package_id": "communications-electronics-hardware-core",
"domain_id": "communications-electronics-hardware",
"title": "通信/电子/硬件工程领域需求澄清术语包（草案）",
"version": "0.1.0",
"status": "draft",
"intents": [
{
"id": "design",
"action": "设计",
"object": "通信/电子/硬件工程相关产物"
},
{
"id": "diagnose",
"action": "排查",
"object": "通信/电子/硬件工程相关问题"
}
],
"dimensions": [
{
"id": "scope",
"name": "系统对象",
"definition": "系统对象的可确认方向。",
"value_type": "selection"
},
{
"id": "method",
"name": "接口与约束",
"definition": "接口与约束的可确认方向。",
"value_type": "selection"
},
{
"id": "symptom",
"name": "问题现象",
"definition": "用户观察到的具体问题、时间、范围和影响。",
"value_type": "free_text"
}
],
"terms": [
{
"id": "core-1",
"term": "系统架构",
"plain_language": "明确设备、链路和协议组成",
"benefit": "方便拆解系统",
"cost": "前期建模需要时间",
"dimension_id": "scope"
},
{
"id": "core-2",
"term": "接口规格",
"plain_language": "明确电气、机械、通信和软件接口",
"benefit": "提高互操作性",
"cost": "规格约束更严格",
"dimension_id": "scope"
},
{
"id": "core-3",
"term": "带宽时延",
"plain_language": "明确吞吐量、延迟和抖动目标",
"benefit": "性能可测量",
"cost": "需要测试环境",
"dimension_id": "scope"
},
{
"id": "core-4",
"term": "功耗散热",
"plain_language": "明确供电、热设计和工作温度",
"benefit": "降低硬件故障",
"cost": "可能增加体积成本",
"dimension_id": "method"
},
{
"id": "core-5",
"term": "兼容认证",
"plain_language": "明确标准、频段和认证要求",
"benefit": "减少上市风险",
"cost": "测试周期更长",
"dimension_id": "method"
}
],
"mappings": [
{
"expression": "专业一点/做好一点",
"level": "L3",
"intent_ids": [
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"method"
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"reason": "需要先明确领域对象和方法约束。"
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}